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Photoresist Strippers & Residue Removers
As the industry drives to smaller geometries, device manufacturers are faced with the integration challenges associated with new materials such as copper interconnects and low-k dielectrics. To reduce time to market, device manufacturers are turning to their suppliers for technical solutions to these new cleaning challenges. The Mallinckrodt Baker Applications Engineering and Research staff has a thorough understanding of today's technical challenges and is committed to developing the advanced chemistries required to meet the needs of the semiconductor, flat panel display, packaging (flip chip, bumps), disk drive, and MEMS industries-today and tomorrow.
Overview by Product Family
| Product Family |
Description |
| PRS and ALEG |
The PRS and ALEG product lines provide versatile cleaning of bulk photoresist and ash/etch residue. These products
are effective in traditional semiconductor (aluminum and silicon dioxide layers), flat panel display, packaging (flip chips/bumps), and disk drive applications. |
| REZI |
Products in the REZI line of residue removers are greater than 80% aqueous and are compatible with aluminum, copper, silicon dioxide, and low-k dielectrics. They are effective in the removal of etch, ash residue, and sidewall polymer from metal and via structures. |
| CLκ |
The CLκ line of photoresist strippers and ash/etch residue removers has been specifically designed for use on copper interconnects, plus sensitive low-k and porous low-k dielectrics. |
Interested in learning more about our performance chemical product line?
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